What is the use of Viscom

Viscom AG. AOI and AXI structure and use of the different systems Advantages and disadvantages of the different systems

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1 Viscom AG AOI and AXI Structure and use of the different systems Advantages and disadvantages of the different systems

2 AOI and AXI Thank you for the invitation! Brief presentation of the Viscom AG electronics production lines and the inspection systems available for them THT solder joint inspection 3D-SPI solder paste inspection 3D-AOI automatic optical inspection of soldered joints 3D-AXI X-ray inspection AOI / AXI combined inspection Topic camera resolution AOI and AXI 2

3 Key data Established: Founder: Business area: Legal form: Turnover: Employees: Installation base: October 1984 Dr. Martin Heuser, Volker Pape Development and production of industrial image processing systems (standard series systems and customer-specific solutions) and X-ray systems. Strong focus on test systems for electronics manufacturing. AG (since 2001), listed since May 2006 approx. 50 million euros, worldwide in 2013 approx. 300 worldwide> 2500 systems (AOI, AXI, SPI, Bond, X-Ray,) AOI and AXI 3

4 Hanover location Five buildings with a total usable area of ​​m² Headquarters (2001) Administration, Sales Project management Usable area m² Production building F2 (1999) CNC manufacturing (mechanics) Pre-assembly Usable area 600 m² Development center (1992) R&D Software Usable area m² Production building F1 (1998) Commissioning of test procedures Usable area 800 m² production building F3 / F4 (F3: 2002, F4: 2005) Warehouse, production Production management Training usable area m² AOI and AXI 4

5 locations worldwide Viscom is present worldwide with its own branches, application centers and service support points. In addition, a dense network of representatives is available for our customers AOI and AXI 5

6 competence areas application - manufacturing technology - sensor technology - physics - software development - IT - construction - mechanical engineering - hardware development - electronics - product management - design AOI and AXI 6

7 Modern assembly assembly Typical assemblies per year Reflow soldered SMD assembly on both sides, additional selectively soldered THT components, thousands of solder points - many of them hidden under component bodies or shield plates. Image source: AOI and AXI 7

8 Construction and connection technology in electronics production Assembly Soldering process Top side Bottom side Top side Bottom side THT Radial / Axial comp. Manual or automatic order SMT in solder paste THT manual assembly SMT on adhesive point - Solder wave SMT in solder paste Reflow oven Reflow oven - - Selective solder wave SMT in conductive adhesive Curing oven AOI and AXI I 8

9 THT Through Hole Technology - wire assembly Automatic wire assembly wave-soldered AOI and AXI I 9

10 THT Through Hole Technology - SMD glued wire assembly, manual wire assembly wave soldered AOI and AXI I 10

11 THT Through Hole Technology - wire fitting THT solder joint inspection from below Viscom S3016 8M camera module monochrome with protective screen above the camera

12 S3016 Functional Principle S S3016 Presentation 12

13 S3016 Functional Principle S S3016 Presentation 13

14 S3016 Functional Principle S S3016 Presentation 14

15 S3016 Functional Principle S S3016 Presentation 15

16 S3016 Functional Principle S S3016 Presentation 16

17 S3016 Functional Principle S S3016 Presentation 17

18 S3016 Functional Principle S S3016 Presentation 18

19 THT Through Hole Technology - Wire assembly Desktop solder joint inspection Viscom S2088-II Viscom 8M sensors

20 S2088-II Functional Principle S2088-II Presentation 20

21 Inspection Solutions for Electronics Manufacturing A typical, modern SMT line configuration? SPI AOI / AXI AOI and AXI 21

22 3D solder paste inspection 3D solder paste inspection Viscom S3088 SPI camera module SE

23 Viscom S3088 SPI recording technology The sensor system (camera with lighting) moves in a meandering shape over the printed circuit board with solder paste and records overlapping images. Step 1 Recognition of the circuit board position using registration marks Printed circuit board with solder paste D solder paste inspection

24 Viscom S3088 SPI recording technology The sensor system (camera with lighting) moves meandering back and forth over the printed circuit board with solder paste and records overlapping images. Step 2 Scanning the circuit board and calculating the inspection results Circuit board printed with solder paste Inspection capacity: up to 80 cm² / s D solder paste inspection

25 Viscom S3088 SPI The stripe projection white light matrix camera Stripe pattern principle Stripe projection detailed illustration of the angle of illumination w Printed circuit board with solder paste D-solder paste inspection 25

26 fringe projection method

27 Viscom S3088 SPI shadow-free test s = h / tan (70) s (70) = hx 36% The illumination angle of the Viscom SPI sensor system is 45 to the PCB transport edge solder paste depot Shadow cast hss = h / tan (70) x sin (45) S (70 ; 45) = hx 36% x 71% s (70; 45) = hx 26% In the case of solder paste depots whose edges run at right angles or parallel to the PCB transport edge, the width of the resulting shadow is approx. 26% of the stencil height, which is a 100 µm Template less than the diameter of a solder ball corresponds to D solder paste inspection s 27

28 lighting from 70 - real paste print (lens-shaped) stencil h = 100µm stop varnish FR4 CU-Land b D-solder paste inspection

29 Lighting from 70 - real paste print (lens-shaped) stencil You don't have such residues in the stencil because you use surface-refined stencils? Then you will probably have the following effect: see next slide! h = 100µm stop lacquer FR4 CU-Land b D-solder paste inspection

30 Viscom S3088 SPI shadow-free test stencil h = 150µm stop lacquer FR4 CU-Land b skip details D-solder paste inspection 30

31 Viscom S3088 SPI shadow-free testing The ergonomic sensor concept based on the adhesive forces enables shadow-free testing of paste depots with just one projector! 70 The offsetting between 2D, 3D and confidence images also provides maximum measurement certainty h = 150µm stop varnish FR4 CU land b skip details D solder paste inspection 31

32 Inspection solutions for electronics manufacturing A typical, modern SMT line configuration SPI AOI / AXI AOI and AXI 32

33 Solder joint inspection Placement inspection (pre reflow) and / or solder joint inspection single track AOI S3088 flex Viscom 8M sensors AOI S3088 Ultra Viscom XM sensors

34 AOI: Different types of lighting for troubleshooting Relevant quality features are emphasized Disturbing effects are eliminated Incident light direct lighting Indirect diffuse lighting Narrow-angle diffuse lighting X-ray - as much as necessary! 34

35 Inclined view for greater test coverage Use of 4 or 8 cameras that record views of the solder joint deflected by mirrors. 4 cameras view the object from angles in 90 steps 8 cameras allow a view from angles in 45 steps There are corresponding image processing algorithms for component rotations that deviate from this. Other providers offer rotatable camera modules for recording inclined X-ray views from any rotation angle - as much as necessary! 35

36 Representation of the inclined views at the verification station

37 Error verification Orthogonal view October 17, 2014 HARAN 37

38 Error verification AV view: 0 scene October 17, 2014 HARAN 38

39 Error verification AV view: 45 scene October 17, 2014 HARAN 39

40 Error verification AV view: 90 scene October 17, 2014 HARAN 40

41 Error verification AV view: 135 scene October 17, 2014 HARAN 41

42 Error verification AV view: 180 scene October 17, 2014 HARAN 42

43 Error verification AV view: 225 scene October 17, 2014 HARAN 43

44 Error verification AV view: 270 scene October 17, 2014 HARAN 44

45 Error verification AV view: 315 scene October 17, 2014 HARAN 45

46 S6056 DS1W transport principle AOI S6056 Viscom XM-Sensorik October 17, 2014 S6056 DS1W transport principle

47 S6056 DS1W transport principle October 17, 2014 S6056 DS1W transport principle

48 S6056 DS1W transport principle October 17, 2014 S6056 DS1W transport principle

49 S6056 DS1W transport principle October 17, 2014 S6056 DS1W transport principle

50 S6056 DS1W transport principle October 17, 2014 S6056 DS1W transport principle

51 S6056 DS1W transport principle October 17, 2014 S6056 DS1W transport principle

52 S6056 DS1W transport principle October 17, 2014 S6056 DS1W transport principle

53 3D-AOI with fringe projection 3D-AOI fringe projection variants (comparison) AOI and AXI I 53

54 Inline solder joint inspection Combined inspection AOI / AXI AOXI X7056RS X7056-RS Functional principle of the combined inspection

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57 AOI / AXI combined inspection system

58 Inspection solutions for electronics production A typical, modern SMT line configuration SPI AOI / AXI MXI AOI and AXI 58

59 Solder joint inspection offline X-ray inspection X8011 PCB NDT X8060-CT

60 X8011 rotary / tilt axes (manipulators) turntable tilt axis detector rotary / tilt axis CT axis X-ray - as much as necessary! 60

61 Manual / semi-automatic X-ray High resolution. high detail recognition! X-ray - as much as necessary! 61

62 Scope of inspection Generation of X-ray images from any direction of view (stepless) BGA in oblique radiation BGA in oblique radiation X-ray - as much as necessary! 62

63 Viscom Quality Uplink image uplink paste uplink TITUS uplink solder uplink process uplink Image uplink Paste uplink Solder uplink TITUS uplink Solder paste error images are transferred to the end of the line All solder paste images and feature values ​​are transferred to the verification station at the end of the line End of line indicated. Total Inspection and Traceability Uplink Services (AOXI on SPI demand) Process uplink Process and feature data are transmitted to the customer MES AOI and AXI 63

64 conformal coating inspection AOI S3088 CCI

65 Bond Wire and Wafer Inspection S6053BO-V Bond Inspection S6053BO-V Video Presentation S6053BO-V Powerpoint Presentation S6053BO-V PDF Brochure MX100-IR Semiconductor Inspection MX100IR Powerpoint Presentation MX2000IR Powerpoint Presentation

66 Viscom AG Selection of topics Interesting facts Presentation Relationship between camera resolution and component size

67 Importance of camera resolution in AOI systems A practical example: Who is this person? If you doubt whether it is the same picture as the miniature, then take a few steps back! Image format 580x680 pixels Images with a high resolution can be enlarged to such an extent that important features are clearly recognizable! Image source:

68 Importance of camera resolution in AOI systems A practical example: Who is this person? If you doubt whether it is the same picture as the miniature, then take a few steps back! Image format 580x680 pixels Images with a high resolution can be enlarged to such an extent that important features are clearly recognizable! Image source:

69 Image format 58x68 pixels The information content of an image with a low resolution is not increased by enlarging the image (sub-pixel interpolation). October 17, 2014 camera resolution 69

70 Image format 58x68 pixels The information content of an image with a low resolution is not increased by enlarging the image (sub-pixel interpolation). October 17, 2014 camera resolution 70

71 Significance of the camera resolution in AOI systems Arguments for a high resolution in automatic optical inspection systems (AOIs) The sub-pixel calculation (interpolation) only works for objects that are significantly larger than a picture element (pixel). Very small objects (solder splashes, chip components of the size or 03015) are displayed with very few pixels. An interpolation only causes blurring, but no increase in the information content. With modern computer technology (multicore PUs) and corresponding data bus structures (64 bit), the processing of high-resolution images does not determine the cycle time. Since only error images have to be archived, the storage requirement for high-resolution images is not critical with the storage media currently available. When using intelligent calibration algorithms and high-quality calibrations, AOI systems with high resolution can achieve very good cmk values ​​with MFUs. The resolution of the cameras used is often not the price-determining factor for an AOI system October 17, 2014 Camera resolution 71

72 Relationship between camera resolution and component size Pixel matrix 11.7 µm / pixel For an orthogonal view (top view), the following applies: length width pixel length pixel width pixel length pixel width component type [mm] [mm] [23.4 µm / px] [ 23.4 µm / px] [11.7 µm / px] [11.7 µm / px], 02 0,, 51 0,, 25 0, RR pixels 22 pixels Relationship between camera resolution and 72 component size

73 when using the inclined view Pixel matrix 8.1 µm / pixel Inclined view of component connection Standard resolution High resolution Length Width Projected pixel length Pixel width Pixel length Pixel width Component type [mm] [mm] Length [mm] [16.2 µm / px] [16.2 µm / px] [8.1 µm / px] [8.1 µm / px], 02 0.51 0,, 51 0.25 0,, 25 0.13 0, R pixels 16 pixel relationship between camera resolution and 73 component size

74 Thank you for your attention! Contact information: Michael Mügge Carl Buderus-Str Tel Hannover Stellv. Head of the Hanover regional group